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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6618-C Issued Date : 1994.05.12 Revised Date : 2000.10.01 Page No. : 1/3 HSC3417 NPN EPITAXIAL PLANAR TRANSISTOR Features * High-Definition CRT Display Video Output Applications * High Breakdown Voltage: BVCEO=300V Absolute Maximum Ratings (Ta=25C) * Maximum Temperatures Storage Temperature ............................................................................................ -50 ~ +150 C Junction Temperature ................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................... 1.2 W Total Power Dissipation (Tc=25C) ...................................................................................... 7 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage .................................................................................... 300 V BVCEO Collector to Emitter Voltage................................................................................. 300 V BVEBO Emitter to Base Voltage ........................................................................................... 5 V IC Collector Current ....................................................................................................... 100 mA Electrical Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE fT Cob Min. 300 300 5 40 Typ. 70 2.6 Max. 100 100 600 1 320 Unit V V V nA nA mV V MHz pF Test Conditions IC=100uA IC=1mA IE=10uA VCB=200V VEB=4V IC=20mA, IB=2mA IC=20mA, IB=2mA IC=10mA, VCE=10V IC=10mA ,VCE=30V, f=100MHz VCB=30V, f=1MHz *Pulse Test : Pulse Width 380us, Duty Cycle2% Classification Of hFE Rank Range C 40-80 D 60-120 E 100-200 F 160-320 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 100000 Spec. No. : HE6618-C Issued Date : 1994.05.12 Revised Date : 2000.10.01 Page No. : 2/3 Saturation Voltage & Collector Current 100 hFE VCE=10 V Saturation Voltage (mV) 10000 1000 VBE(sat) @ IC=10IB 100 VCE(sat) @ IC=10IB 10 1 0.1 1 10 100 1000 10 0.1 1 10 100 1000 Collector Current (mA) Collector Current (mA) Capacitance & Reverse-Biased Voltage 100 1000 Cutoff Frequency & Collector Current 10 Cutoff Frequency (MHz) Capacitance (pF) 100 VCE=30 V Cob 1 0.1 1 10 100 1000 10 1 10 100 Reverse Biased Voltage (V) Collector Current (mA) Safe Operating Area 1000 PT=1ms PT=100ms PT=1s Collector-IC (mA) 100 10 1 1 10 100 1000 Forward Biased Voltage-VCE (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-126ML Dimension Marking : Spec. No. : HE6618-C Issued Date : 1994.05.12 Revised Date : 2000.10.01 Page No. : 3/3 A B D E F 3 2 I G 1 J M L K O H HSMC Logo Part Number Date Code Product Series Rank Ink Marking C Style : Pin 1.Emitter 2.Collector 3.Base N 3-Lead TO-126ML Plastic Package HSMC Package Code : D *:Typical DIM A B C D E F G H Inches Min. Max. 0.1356 0.1457 0.0170 0.0272 0.0344 0.0444 0.0501 0.0601 0.1131 0.1231 0.0737 0.0837 0.0294 0.0494 0.0462 0.0562 Millimeters Min. Max. 3.44 3.70 0.43 0.69 0.87 1.12 1.27 1.52 2.87 3.12 1.87 2.12 0.74 1.25 1.17 1.42 DIM I J K L M N O Inches Min. Max. *0.1795 0.0268 0.0331 0.5512 0.5906 0.2903 0.3003 0.1378 0.1478 0.1525 0.1625 0.0740 0.0842 Millimeters Min. Max. *4.56 0.68 0.84 14.00 15.00 7.37 7.62 3.50 3.75 3.87 4.12 1.88 2.14 Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification |
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